Responsibilities
Lead and manage EWLB/WLB Operations, covering Manufacturing, Process, and Equipment functions.
Develop strategic plans and goals, assign tasks, promote strategies to drive operational performance and team development.
Decide on operations matters and ensure achievement of operational objectives effectively and efficiently.
Lead and drive new package qualifications from design stage to high-volume production, ensuring readiness, quality, and yield stability.
Oversee daily operations performance, including yield, defect, output, downtime, and drive root cause analysis and corrective actions.
Sustain and continuously improve yield, quality, and productivity through systematic problem-solving and continuous improvement methodologies (e.g. FMEA, SPC, DOE, MSA).
Drive maximizing capacity utilization, stable process performance, to comply quality & safety standards and other requirements.
Provide leadership and direction to managers, engineers, and supervisors, fostering teamwork and continuous improvement culture.
Collaborate with cross function teams eg Quality, Planning to ensure smooth production flow and timely issue resolution.
Requirements
Preferably 20 years of related experience in Semiconductor or related industry in wafer-level packaging.
Degree in Engineering or its equivalent.
Proven record in strategic planning, cost management, yield improvement, and large-scale manufacturing leadership.
Deep knowledge of wafer-level manufacturing, process integration, and equipment engineering.