Responsibilities
The incumbent will lead a team of process and equipment engineers responsible for the photolithography area in a 12” wafer bumping fabrication line. This role ensures robust process control, high equipment uptime, continuous yield improvement, and new technology / process introduction to support advanced wafer-level packaging (WLP) and bumping operations.
Operations & Process Management
Lead and manage daily photolithography operations, ensuring smooth production support and timely response to line issues.
Owned process stability, yield performance, and defect reduction with the photolithography section.
Develop and maintain robust process control systems (SPC, DOE, FMEA, OCAP, FDC).
Drive continuous improvement using structured problem-solving methodologies (8D, DMAIC, Kaizen).
Ensure all process changes are properly documented and qualified following engineering control protocols.
People and Team Development
Lead, coach and develop a team of engineers and technicians to achieve operational excellence.
Set clear KPIs for yield, defect density, costs, cycle time and equipment availability.
Build technical depth and cross-functional capability within the team.
Foster a culture of ownership, teamwork, and continuous improvement.
Quality, Safety & Compliance
Ensure adherence to EHS, quality, and ISO standards (ISO9001, IATF16949, ISO14001).
Champion 6s, safety culture, and contamination control practices in the cleanroom.
Participate in internal / external audits and customer visits.
Requirements
Bachelor’s or master’s degree in engineering (Microelectronics, Material Science, Chemical / Electrical, or related field.
Min 8 – 10 years of relevant semiconductor process experience, with at least 3 -5 years in photolithography.
Experience in 12” wafer bumping or WLP (UBM, RDL, Cu pillar, or solder bumping) is highly preferred.
Proven track record in leading engineering teams and driving yield / process improvements.
Strong familiarity with stepper / aligner platforms and track systems.